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Browse Prior Art Database

Single Substrate AC Gas Panel With Plasma Barriers

IP.com Disclosure Number: IPCOM000048630D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Campagna, FJ: AUTHOR [+2]

Abstract

An improved method of fabricating a gas panel which eliminates some of the standard operations required in conventional gas panel fabrication operates as follows. The panel construction is basically a plasma panel in which discrete aluminum wires are bonded to a glass substrate. Alternate conductors function as the drive lines, while the remaining conductors function as barriers to prevent charge spreading. The wires are then anodized to form a dielectric layer of aluminum oxide, and constructed on a single substrate to eliminate the spacer requirement.

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Single Substrate AC Gas Panel With Plasma Barriers

An improved method of fabricating a gas panel which eliminates some of the standard operations required in conventional gas panel fabrication operates as follows. The panel construction is basically a plasma panel in which discrete aluminum wires are bonded to a glass substrate. Alternate conductors function as the drive lines, while the remaining conductors function as barriers to prevent charge spreading. The wires are then anodized to form a dielectric layer of aluminum oxide, and constructed on a single substrate to eliminate the spacer requirement.

Referring to the drawing, a glass substrate 11 has horizontal conductors 13 and 15 bonded to the substrate using a process such as field-assisted bonding. The conductors are then anodized to provide a dielectric coating. A vertical conductor array, shown as conductors 17-20, is then bonded in the vertical direction, ensuring that the contours of the underlying conductors are followed at the crossovers. The vertical conductors are then anodized, and aluminum wires 14 and 16 are bonded between conductors 13 and 15 in the manner illustrated. The crossovers of each alternate conductor define the gas panel cell locations at cells 25,27,29,31. A sealing cycle is then used to close the surface through a standard manufacturing process, and the completion of the panel is provided by conventional gas panel technology, such as magnesium oxide deposition, panel seal and backf...