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Hot Stamping Metallized Circuit

IP.com Disclosure Number: IPCOM000048703D
Original Publication Date: 1982-Mar-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Juchniewicz, JJ: AUTHOR [+2]

Abstract

A circuit printing technique is provided which is derived from known hot stamping processes used for placing patterns on materials other than circuit board substrates.

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Hot Stamping Metallized Circuit

A circuit printing technique is provided which is derived from known hot stamping processes used for placing patterns on materials other than circuit board substrates.

This technique is useful in the fabrication of inexpensive mass produced circuits. Circuit patterns are transferred from metallized foil to a substrate by means of heat and pressure applied through a hot stamp die having the circuit patterns on its operative surface. Unused metallized tape may be repositioned to minimize waste in a subsequent operation.

An example of the use of this technique is producing an intricate circuit pattern on a polymer disk to form a capacitive emitter.

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