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Anodized Aluminum Plated Copper Gas Panel Conductors

IP.com Disclosure Number: IPCOM000048810D
Original Publication Date: 1982-Mar-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Altimari, R: AUTHOR [+4]

Abstract

Aluminum and aluminum alloy ribbon and wire have been used to produce field-assisted bonded Bas panels in which discrete conductors are bonded to the glass plates. Although aluminum is an excellent material in terms of its bonding characteristics, it exhibits several deficiencies with respect to other properties. These include low tensile strength, aluminum-copper interactions at the connectors, and cost. In addition, attempts to produce a controlled thickness aluminum oxide (Al(2)O(3)) dielectric film on the conductor surface by conventional anodization techniques have been largely unsuccessful due to an inability to prevent excessive anodization, resulting in non-conductive lines.

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Anodized Aluminum Plated Copper Gas Panel Conductors

Aluminum and aluminum alloy ribbon and wire have been used to produce field-assisted bonded Bas panels in which discrete conductors are bonded to the glass plates. Although aluminum is an excellent material in terms of its bonding characteristics, it exhibits several deficiencies with respect to other properties. These include low tensile strength, aluminum-copper interactions at the connectors, and cost. In addition, attempts to produce a controlled thickness aluminum oxide (Al(2)O(3)) dielectric film on the conductor surface by conventional anodization techniques have been largely unsuccessful due to an inability to prevent excessive anodization, resulting in non-conductive lines.

Recent advances in aluminum plating techniques have resulted in the availability of aluminum plated copper in appropriate fine wire gauges. This material has the tensile strength and cost potential of copper wire, and may be stripped to provide copper-to-copper connector interfaces. Uniform Al(2)O(3) growth is achieved by anodizing the aluminum plating to completion at the aluminum-copper interface, while conductivity of the line is maintained by the copper core.

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