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Drive Module With Output Leads On Same Pitch As Gas Panel Conductors

IP.com Disclosure Number: IPCOM000048815D
Original Publication Date: 1982-Mar-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Costa, MJ: AUTHOR

Abstract

Normally, the drive modules for a plasma display device, which provide write, erase and sustain signals to the display lines, are mounted on "driver" boards which are connected to the panel by lengths of flexible circuit. In one arrangement described by way of example, the modules are 40-pin dual, in-line, plastic packages with leads on 100-mil centers. Driver boards are located behind the panel, and the flex circuits make the 180 Degree turn needed in going from the plane of the panel to a parallel board mounted behind it. Each output lead on a module drives one panel line, and the outputs are grouped around the edge of the module in ordered sequence.

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Drive Module With Output Leads On Same Pitch As Gas Panel Conductors

Normally, the drive modules for a plasma display device, which provide write, erase and sustain signals to the display lines, are mounted on "driver" boards which are connected to the panel by lengths of flexible circuit. In one arrangement described by way of example, the modules are 40-pin dual, in-line, plastic packages with leads on 100-mil centers. Driver boards are located behind the panel, and the flex circuits make the 180 Degree turn needed in going from the plane of the panel to a parallel board mounted behind it. Each output lead on a module drives one panel line, and the outputs are grouped around the edge of the module in ordered sequence. The same sequence is maintained in the board conductors which connect the module output pins to uniformly spaced lands on the driver board edge for mating with the flex circuits.

Referring to Fig. 1, the lead frame design 2 has output leads 3 with the same pitch as the gas panel conductors. By matching the panel conductor pitch, modules can mount directly on the panel conductors, eliminating additional parts such as driver boards or flex circuits used to make a pitch transformation, resulting in significant cost reductions. The driver chip in the preferred embodiment has 32-output peds sequentially spaced around three sides of the chip perimeter. Mounted on chip platform 5, the output pads on the chip are wire bonded in sequence to leads 6 of fram...