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Diamond Lapping Pad

IP.com Disclosure Number: IPCOM000048859D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Abbott, CD: AUTHOR

Abstract

A resilient pad is used to lap a ferrite block used in a magnetic head. The pad is glued to the lapping plate and a diamond paste is distributed onto the pad. A roller is used to embed the paste into the pad. The ferrite pieces are held in a fixture and lapped by the paste-coated pad.

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Diamond Lapping Pad

A resilient pad is used to lap a ferrite block used in a magnetic head. The pad is glued to the lapping plate and a diamond paste is distributed onto the pad. A roller is used to embed the paste into the pad. The ferrite pieces are held in a fixture and lapped by the paste-coated pad.

The standard method of lapping involves the use of a slurry which is sprayed onto the lapping plate. The surface that is being lapped can be scratched since the diamond particles are loose and are seeking a place where they can secure themselves to the plate. A scratch free finish can be obtained on the ferrite pieces by gluing a resilient pad to the lapping plate. The pad is a polyurethane- impregnated polyester felt. The pad is generally 0.15 inch in thickness and has an adhesive backing for attachment to the lapping plate. A diamond abrasive paste is distributed onto the pad, and a roller is used to further embed the diamond paste into the resilient pad. The ferrite pieces are placed into a holding fixture and held in the lapping apparatus. The ferrite pieces are then lapped by the lapping plate. The lapping time is reduced to obtain a polishing effect without causing a rounding of the edges due to the resilient pad. The lapping plate remains in the proper condition for a longer period of time with the use of the resilient pad embedded by the diamond particles.

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