Browse Prior Art Database

I/O Edge Connector For MC Substrates

IP.com Disclosure Number: IPCOM000048933D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+3]

Abstract

MC (metallized ceramic) substrates are I/O-pin limited. To increase the size of the MC substrate to overcome this problem would require a large capital expense to upgrade the manufacturing tools and machines to accommodate the larger substrate. The present concept would directly add 52 I/O pins to an MC substrate with the possibility of extending it to 104 added I/O pins. The capital expense would be kept to a minimum because a standard substrate would be used.

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I/O Edge Connector For MC Substrates

MC (metallized ceramic) substrates are I/O-pin limited. To increase the size of the MC substrate to overcome this problem would require a large capital expense to upgrade the manufacturing tools and machines to accommodate the larger substrate. The present concept would directly add 52 I/O pins to an MC substrate with the possibility of extending it to 104 added I/O pins. The capital expense would be kept to a minimum because a standard substrate would be used.

The MC substrate 1 can be designed to include solder pads 2 around the periphery of the substrate. Soldered to these pads are the I/O pins 3 which are an integral part of the I/O clip-on molding 4 which is slid on to the four edges of the substrate.

The design of the clip-on molding has the following unique features:

A. The I/O pins 3 are designed to make an electrical

contact with the solder

pads 2 and also act as springs which clamp to the

MC substrate to allow easy assembly and oven soldering

of the I/O pins to the solder pads on the substrate.

B. The protruding lip 5 has been provided to clamp

against the substrate and

also make a seal with the substrate to prevent

SCOTCHCAST* leakage into the module during the

sealing operation.

C. The protrusion 6 has been added to act as a dam to any

SOCTCHCAST that may

tend to leak into the module during the sealing

operation. This protrusion goes completely

around the substrate and will prevent

any SCOTCHCAST from reaching the...