Browse Prior Art Database

Semiconductor Package

IP.com Disclosure Number: IPCOM000048968D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Ecker, ME: AUTHOR

Abstract

This article describes a semiconductor package providing for area array power distribution and signal redistribution with a minimum of wiring layers.

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Semiconductor Package

This article describes a semiconductor package providing for area array power distribution and signal redistribution with a minimum of wiring layers.

A prefired ceramic substrate 0.015 inch thick is laser drilled so as to have a suitable number of 0.006-inch diameter holes disposed in a predetermined pattern. The predetermined hole pattern is screen-filled with a suitable electrically conductive paste and fired to produce a metal path through the ceramic substrate. On one surface a series of metal patterns are sequentially screened between layers of a screened glass frit and fired so as to effect a multilayer metal pattern disposed about a pattern of metal-filled holes. Some of the metal-filled holes are intentionally connected to appropriate segments of the metal pattern embedded in the glass frit.

All of the metal-filled holes have suitably sized pads (metal) fired to them and are exposed through the glass frit so that metal pins may eventually be brazed to them. These pins will eventually be used for connection to a printed circuit card. The pins connected to the embedded metal pattern segments are inputs to a uniquely configured power distribution arrangement designed so as to converge and connect to appropriate metal-filled holes grouped directly under the region of ceramic to be occupied by a semiconductor die. All of the metal-filled holes outside of the semiconductor die mounting region are connected to filled holes free of connectio...