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Method and Apparatus for Removing Internal Circuit Shorts in a Multilayer Ceramic Substrate

IP.com Disclosure Number: IPCOM000048969D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Deskur, KJ: AUTHOR [+2]

Abstract

This technique permits electrical shorts to be removed in buried conductors incorporated in a multilayer ceramic substrate.

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Method and Apparatus for Removing Internal Circuit Shorts in a Multilayer Ceramic Substrate

This technique permits electrical shorts to be removed in buried conductors incorporated in a multilayer ceramic substrate.

Fig. 1 shows a multilayer ceramic substrate 10 incorporating a first buried conductor 12 and a second buried conductor 14. The conductors have become shorted together in an area 15 because of faulty manufacturing processes. This technique permits the shorted connection 15 to be removed without destruction of the substrate 10. In Fig. 2, a test circuit is shown which when connected to the substrate 10 at terminals 16 and 18 can be operated to remove the shorted area
15. The test circuit includes supply voltage 20 and a series of capacitors C of different magnitudes, where A, B, and C are integers of increasing value, respectively. The capacitors are multipled together at one end and connected to a contact of a double-throw switch 22. The other ends of the capacitor serve as terminals for a capacitor select switch 24. The other side of the switch 24 is connected to a second terminal of the switch 22. One side of the battery 20 is also connected to the terminal, and the other side of the battery is connected to the multipled connection among the capacitors.

The third and fourth terminals of the switch 22 are connected to probes which engage the terminal pads 16 and 18. The switch 22 is also adapted to connect to the terminals of an ohmmeter 26.

A pulse o...