Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Heater for Interposer between Chip and Heat Sink in Multi-Chip Module

IP.com Disclosure Number: IPCOM000049036D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR

Abstract

In a multi-chip module, a heater element is located between the chips and a heat sink. Chips that operate at low power can be raised to the temperature of chips that operate at high power. When power to the chips is turned off, the heater element maintains the module at a sufficient temperature to prevent the relative humidity outside the module from rising excessively.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Heater for Interposer between Chip and Heat Sink in Multi-Chip Module

In a multi-chip module, a heater element is located between the chips and a heat sink. Chips that operate at low power can be raised to the temperature of chips that operate at high power. When power to the chips is turned off, the heater element maintains the module at a sufficient temperature to prevent the relative humidity outside the module from rising excessively.

Some semiconductor chips operate at a high power and require special cooling techniques. For example, a heat sink may contact the surface of the chip opposite its component surface. In a multi-chip module, chips operate at different power levels and low power chips may be cooled so much that they operate at an undesirably low temperature. One technique for keeping the chips at equal temperatures is to locate a thin interposer between the heat sink and the low power chips. The heater element is in the form of a thin electrically resistive film formed as part of the interposer. Heating current for the resistive film is controlled by one or more temperature sensors located to sense the temperature of a chip or a group of chips. A firm or several discrete films are shaped to cover only the low power chips or to cover all the chips. (The heat sink handles the additional heat at the location of the high power chips.)

1