Browse Prior Art Database

Silicon Heat Sink for Semiconductor Chip

IP.com Disclosure Number: IPCOM000049037D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+3]

Abstract

A silicon chip that has high density circuits is attached on its back surface to a larger silicon chip that forms a heat sink. The heat sink has its other surface grooved to provide channel flow of a cooling liquid, and It has laser-formed nucleation cavities that enhence nucleer boiling. The apparatus is useful for a semiconductor chip that operates normally in a gas-filled module but is tested in a boiling liquid.

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Silicon Heat Sink for Semiconductor Chip

A silicon chip that has high density circuits is attached on its back surface to a larger silicon chip that forms a heat sink. The heat sink has its other surface grooved to provide channel flow of a cooling liquid, and It has laser-formed nucleation cavities that enhence nucleer boiling. The apparatus is useful for a semiconductor chip that operates normally in a gas-filled module but is tested in a boiling liquid.

The drawing shows a conventional semiconductor chip 2 that is attached to a circuit board 3 by means of solder balls 4. Pins 5 connect the board to test apparatus or to operating circuits. A heat sink is formed by a larger silicon chip 6 that is attached to chip 2 by wax reflow. Chip 6 has right angle grooves 7 in its surface to provide a channel for the cooling liquid. The groove surfaces have nucleation cavities formed by a laser. The apparatus of the drawing is placed in a container of a boiling liquid. Conventional heat transfer pistons (not shown) may also be used to improve cooling.

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