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Browse Prior Art Database

Fabrication of an Improved Membrane Substrate

IP.com Disclosure Number: IPCOM000049071D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Guarnieri, CR: AUTHOR [+2]

Abstract

Presently membrane substrates are used for a variety of applications. Some examples would be X-ray masks, electron microscopy sample holders, and nanostructure substrates. These membranes are produced by depositing the desired membrane material onto a silicon wafer. The opposite side of this wafer is coated with a mask and patterned. The wafer is then "backetched" to remove the silicon from beneath membrane material. Many membranes are usually produced from a single wafer. The wafer must then be cut or "diced" to produce individual membranes (chips). Dicing is done by using either a diamond scribe or a cutting saw.

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Fabrication of an Improved Membrane Substrate

Presently membrane substrates are used for a variety of applications. Some examples would be X-ray masks, electron microscopy sample holders, and nanostructure substrates. These membranes are produced by depositing the desired membrane material onto a silicon wafer. The opposite side of this wafer is coated with a mask and patterned. The wafer is then "backetched" to remove the silicon from beneath membrane material. Many membranes are usually produced from a single wafer. The wafer must then be cut or "diced" to produce individual membranes (chips). Dicing is done by using either a diamond scribe or a cutting saw.

There are disadvantages associated with these methods. Many membranes are broken and copious amounts of dirt are produced which severely contaminate the membrane area. The contaminants cannot be thoroughly cleaned from the membranes due to their fragile nature. Any contamination on the membrane surface can influence the experiments they are used in. Also, scribing is not capable of producing membrane chips with accurate and reproducible dimensions. This is a problem because the sample holders in most electron microscopes require accurately dimensioned samples.

A technique which eliminates the need for the previously mentioned dicing methods is described. Fabrication begins with the deposition of the desired membrane material onto a silicon wafer of (100) orientation. This substrate has an oxide layer on the back side only of some suitable thickness (Fig. 1). A layer of photoresist is then deposited on the back side and patterned. This pattern delin...