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Assembly of Josephson Circuit Package

IP.com Disclosure Number: IPCOM000049084D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Sokolowski, J: AUTHOR

Abstract

In Josephson packaging, modules having pins thereon have to be inserted into a board containing cavities filled with liquid mercury. Due to the surface tension of the mercury, the modules often become separated from the board prior to the placement of permanent retention springs. This separation can cause the guide pins to separate from their aligned guide holes, and may cause later alignment problems. The pick-up tool used to plate the module over the board generally has to be moved away during the spring-clamping operation, due to space limitations. To solve this problem and to maintain alignment between the module and the board, a weight interposer is used between the pick-up tool and the module.

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Assembly of Josephson Circuit Package

In Josephson packaging, modules having pins thereon have to be inserted into a board containing cavities filled with liquid mercury. Due to the surface tension of the mercury, the modules often become separated from the board prior to the placement of permanent retention springs. This separation can cause the guide pins to separate from their aligned guide holes, and may cause later alignment problems. The pick-up tool used to plate the module over the board generally has to be moved away during the spring-clamping operation, due to space limitations. To solve this problem and to maintain alignment between the module and the board, a weight interposer is used between the pick-up tool and the module.

In the drawing, the pick-up tool 10 is capable of x-y-z motions and has vacuum lines 12 and 14. The weight-interposer 16 has a vacuum line 18 that communicates with vacuum line 12 when tool 10 and weight interposer 16 are in contact with one another.

In operation, tool 10 is placed over weight-interposer 16 and vacuum 2 is turned on, holding these components together. Both components are placed over module 20 having pins 22 thereon, and vacuum 1 is turned on. Components 10, 16 and 20 form one unit, which is moved into position, and pins 22 are inserted into a board (not shown).

Vacuums 1 and 2 are then turned off, and tool 10 is moved away. Interposer 16 remains on module 20, pressing downward during clamping of permanent retentio...