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Browse Prior Art Database

Cooling a Thermal Print Head

IP.com Disclosure Number: IPCOM000049097D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Firth, RV: AUTHOR [+2]

Abstract

Improved cooling of thermal print heads is provided as a result of better registration between a thermal print head on a ceramic substrate and its heat sink.

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Cooling a Thermal Print Head

Improved cooling of thermal print heads is provided as a result of better registration between a thermal print head on a ceramic substrate and its heat sink.

The figure shows a cross-section of the ceramic substrate 1 adjacent to heat sink 2. Actual contact therebetween is made only at surfaces 3, 4, and 5. The other opposing surfaces are separated by a layer of thermal grease 6. The top surface 7 of substrate 1 is the base for multilayers of materials comprising one or more rows of resistive heating elements, such as illustrated at 8 and 9.

The uneven length rib structure of substrate 1 is used to obtain vertical registration of substrate 1 relative to heat sink 2 in the specific zone where normal force is applied by a print platen.

This construction does not permit deflection of the substrate within that zone. Surfaces 3 and 5 are precisely machined to be parallel to surface 7. This relationship insures that print elements are established and maintained in essentially a flat plane. Thus, the rate of heat transfer to the print medium from the print head is more uniform.

Spring 10 or other suitable means is used to bias substrate 1 against vertical surface 4 of heat sink 2. This bias aids in establishing and maintaining print line registration of substrate 1 relative to heat sink 2 which is grounded along the print line axis. Mounting the print head in this manner permits linear expansion of both the ceramic substrate 1 and heat sink...