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Immersion Soldering Apparatus

IP.com Disclosure Number: IPCOM000049132D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Kohn, H: AUTHOR

Abstract

Plated through holes in a printed circuit board can be soldered with improved reliability by using a slight positive pressure on the flux and then lowering the board to the solder during the soldering operation.

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Immersion Soldering Apparatus

Plated through holes in a printed circuit board can be soldered with improved reliability by using a slight positive pressure on the flux and then lowering the board to the solder during the soldering operation.

Referring to the figure, the soldering apparatus comprises generally a holding fixture 1 and solder pot 2. In the fixture, printed circuit board 3 with through-holes 4 is held by clamps 5 over the open bottom of the fixture. A vibrator 6 is secured to fixture handle 7. Adjustable stops 8 attached to the sides of the fixture support the fixture at various levels in the solder pot 2 by placement on rests 9. The solder pot contains molten solder 10 covered with a layer 11 of flux, both maintained at the required operating temperatures.

When the fixture is lowered to its first rest stops 12, it extends into the solder pot and flux trapped by skirt 13 is forced upward through holes 4, both cleaning and clearing air and gases. Flux passing through the holes floods the upper surface of the board. Board 3 remains in this position until properly preheated for soldering.

After preheating, the board is lowered to rest stops 14 and in contact with the solder trapped by the skirt until soldering is completed. Fixture and board are then raised to rest position 15 for draining, during which flux returns to the solder pot through openings 16 and check valves 17. The board fixture is vibrated during both fluxing and soldering.

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