Browse Prior Art Database

Bonding Pad Transfer

IP.com Disclosure Number: IPCOM000049133D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Lubert, KJ: AUTHOR

Abstract

Scrap or otherwise superfluous bonding pads are used to repair missing or damaged pads in a printed circuit (PC) board or the like.

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Bonding Pad Transfer

Scrap or otherwise superfluous bonding pads are used to repair missing or damaged pads in a printed circuit (PC) board or the like.

For example, normally a signal bond pad is generally provided between the two engineering change (EC) printed circuit lands 11 and 12. The pad and lands 11 and 12 are part of the PC pattern located on the upper surface of the board 10, but for the sake of explanation the pad is missing, as shown in Fig. 1. The pad interconnects the two signal lands 11 and 12, and if an EC is required at the particular location the pad is disconnected from a predetermined one of the lands 11 and 12.

A replacement pad 13 (Fig. 2) is removed from a scrap board (not shown) by any suitable means, e.g., a modeler's or hobbyist's knife. Pad 13 is then affixed by an epoxy 14 to the board 10 at the site of the aforementioned missing pad which is located between lands 11 and 12 and juxtaposed adjacent to the bonding pad 15 of ground conductor 16. As a result, board 10 is made operational and the EC can be effected to the desired land, e.g., land 12, by bonding a wire lead 17 to it and pad 13, thereby obviating the need to scrap board 10 because of the aforementioned missing pad.

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