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Compact Thermal Conduction Module

IP.com Disclosure Number: IPCOM000049153D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Kumar, AH: AUTHOR [+2]

Abstract

Described is a design of and a method for the attachment of a hermetic cap, and an arrangement for cooling device chips in a multilayer module.

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Compact Thermal Conduction Module

Described is a design of and a method for the attachment of a hermetic cap, and an arrangement for cooling device chips in a multilayer module.

With reference to Fig. 1, a nickel plated K0VAR* L-section flange 1 is first brazed to a sintered molybdenum seal band 2 integral with the ceramic substrate
3. Copper can be used for brazing the flange directly to the molybdenum. Other brazing alloys can be used after prior nickel plating of the seal band. A metal cap 4 is then placed on the flange 1 as shown and is sealed with solder preforms to form the hermetic filler seal 5. If a eutectic Pb-Sn solder is used, the cap can be removed or resealed by heating to about 200 degrees C.

The arrangement for cooling the chips is illustrated in Fig. 2.

Rectangular cooling blocks 6 of aluminum or copper are suspended from the roof of the cap 4 using accordion springs 8 made of beryllium copper or copper. The latter are either brazed or soldered to the roof of the cap. When the cap is placed over the flange, the individual cooling blocks will rest gently on the chips 7, making good thermal contact. Any desired vertical displacement of the cooling block will be accommodated by the folding or unfolding of the accordion spring.

The above arrangement for cooling and hermetic sealing makes the module compact and easy to fabricate. * Trademark of Westinghouse Electric Corporation.

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