Browse Prior Art Database

Chip Cooling Employing Alloys Having Different Solidus Temperatures

IP.com Disclosure Number: IPCOM000049155D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Hassan, JK: AUTHOR [+3]

Abstract

Low melting point bismuth alloys having two different melting e points are employed at the successive interfaces in a heat transfer path from a chip to the ultimate heat radiator so as to provide a conformable self healing heat conducting material at the respective interfaces.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 2

Chip Cooling Employing Alloys Having Different Solidus Temperatures

Low melting point bismuth alloys having two different melting e points are employed at the successive interfaces in a heat transfer path from a chip to the ultimate heat radiator so as to provide a conformable self healing heat conducting material at the respective interfaces.

A cooling device which implements the principle of the different melting-point alloys is shown in the drawing. This is but one of many that may be devised which exploit this principle.

The chip 10 is supported on substrate 11, to which are made the necessary electrical connections. For cooling purposes the chip is overlaid with a bismuth alloy "solder" 12 having a first composition.

A piston 13, usually of aluminum because of its high thermal conductivity and specific heat, is urged into intimate surface contact with the "solder" 12 by a force F, for example, by a spring.

A hat 14 having "solder" 15 interposed between it and the piston 13 is the last of the members in the series heat path. Because of the diagonally applied force F the "solders" 12 and 15 are subjected to a mild compressive force.

Since the chip 10 is the source of heat and the hat 14 is the final heat sink, there will be a heat flow from the chip 10 seriately through "solder" 12, piston 13 , solder 15 to the hat 14 with decreasing temperatures as the heat flow progresses in that direction. As is to be expected, the heat flow at each interface experiences a change in slope in the thermal gr...