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Enhanced Thermal Conduction Piston

IP.com Disclosure Number: IPCOM000049163D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Mansuria, MS: AUTHOR [+2]

Abstract

This conduction piston provides enhanced thermal conduction between a heat source and a heat sink, such as a substrate mounted chip and a colte late.

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Enhanced Thermal Conduction Piston

This conduction piston provides enhanced thermal conduction between a heat source and a heat sink, such as a substrate mounted chip and a colte late.

In this cooling arrangement, heat generated by device 10, mounted on substrate 12 with solder connections 14, is transferred to cold plate 16 by hollow piston 18. The walls of hollow piston 18 are slidably mounted in annular groove 20 formed in cold plate 16. Clearance between the walls of piston 18 and the groove 20 is sufficient to allow limited tilting of the piston which provides close surface contact between the end surface 22 of piston 18 and the top surface of device 10. Spring 24, centrally mounted in hollow piston 18, maintains the piston in extended relation and in close contact with the device 10. A low melting metal or alloy can be reflowed between the device 10 and piston 18 to provide conformal contact. Spring 24 will maintain the conformal contact to thereby reduce the thermal resistance between the piston and device interface.

The piston arrangement mounted in groove 20 provides a large area of surface contact between both the inner and the outer walls of the piston that reduces the thermal resistance across the piston and cold plate interface. The increased area of surface allows the length of the piston 18 to be reduced, which in turn permits greeter tilting and the accompanying capabilities to contact the back surface of the device. Annular groove 20 can be forme...