Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Integrated Circuit Chip Passivation Etching Technique

IP.com Disclosure Number: IPCOM000049285D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Betz, PW: AUTHOR [+2]

Abstract

This technique reduces fracturing and chipping of integrated circuit passivation layers during chip dicing by removing a narrow strip of the passivating layer around the perimeter of individual chips at the time via holes are etched through the passivation layer.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Integrated Circuit Chip Passivation Etching Technique

This technique reduces fracturing and chipping of integrated circuit passivation layers during chip dicing by removing a narrow strip of the passivating layer around the perimeter of individual chips at the time via holes are etched through the passivation layer.

Passivation techniques in the IC industry have relied heavily on plasma- enhanced nitride films, either alone or in conjunction with organic films. A combination of nitride film properties and/or chip dicing tool effects can cause the passivation nitride to fracture and chip during dicing, creating passivation failure points. Nitride trenching prevents these failure points from being propagated into the chip structure, thus preventing passivation failure.

Nitride trenching is accomplished by a change to the passivation via hole mask. An image is placed at the chip edge boundary between the active chip area and the chip dicing area. This trenching image is the same contrast as the via hole image. Its size (width) should be no less than that of the smallest via hole dimension. The photo processing that then defines the passivation via hole will create a trench in the passivation material between the dicing area and the active chip passivation.

In applications where the material under the passivation film in the trench area does not create an etch stop, masks used for defining earlier applied layers can be modified to create an etch stop under the trench...