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Process for Testing the Operation of an Indexable via Punching Apparatus

IP.com Disclosure Number: IPCOM000049337D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Kutch, G: AUTHOR [+2]

Abstract

This process provides an accurate and rapid indication of punch apparatus operation by the inspection of a fully punched sheet of material and noting any differences in shading due to the remaining web material.

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Process for Testing the Operation of an Indexable via Punching Apparatus

This process provides an accurate and rapid indication of punch apparatus operation by the inspection of a fully punched sheet of material and noting any differences in shading due to the remaining web material.

A known apparatus for punching via hole patterns in sheet material, in particular, ceramic green sheet, is depicted and described in the IBM Technical Disclosure Bulletin 16, 3921 (May 1974). The basic mode of operation is illustrated in Fig. 1, which shows a punch head 10, in greatly simplified form, having a plurality of spring-biased punches 12 arranged in a grid. The substrate 14 is positioned below the head 10 on an indexable support (not shown). The head, when brought over the substrate, is capable of punching a grid of via holes 16 with each punch. The table, when indexed in the X and Y directions, as indicated by arrows 18 and 20, respectively, will displace the substrate 14 an incremental distance, thereby making possible additional holes displaced from the ones shown forming a grid of holes. Thus, if the table is indexed 17 steps in the X direction and 17 steps in the Y direction, a total of 17x17 holes can be punched in each square defined by 4 holes in sheet 16.

In operation, an interposer mask is located over the substrate with holes to define the desired holes to be punched in the sheet. When one of the punches during the indexing operation is located over a hole in the interposer mask, the punch passes through the hole and onto the sheet, providing a via hole. When no hole is desired, the inter...