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Browse Prior Art Database

Wet Control Tool for Semiconductor Chip Joining Assembly

IP.com Disclosure Number: IPCOM000049362D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Gonin, RV: AUTHOR [+3]

Abstract

A key problem of the automatic chip to ceramic substrate-joining assembly is guaranteeing that the chip pads are at the right position over the substrate conductive lands.

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Wet Control Tool for Semiconductor Chip Joining Assembly

A key problem of the automatic chip to ceramic substrate-joining assembly is guaranteeing that the chip pads are at the right position over the substrate conductive lands.

This problem has been generally solved so far by visual inspection from the chip edge, the control of at least 3 sides; therefore, this technique is rather time consuming. In addition, it also has inherent limitations for part numbers where the pads, disposed at the center of the chip, are not visible at all.

The equipment, described and depicted in Figs. 1 and 2, allows the control of all types of chips. Defective alignment can also be corrected.

A sample substrate, such as provided by the chip-positioning machine, which supports the chip affixed by a drop of flux, is first disposed under a slideable head which bears a vacuum-operated pipette. The chip is separated from the substrate, and raised due to the pipette and the Z motor which controls the head.

An optical arrangement (basically a set of prisms) which allows the between. The operator can control the alignment with the binocular, and assures that the chip pads and the conductive lands are correctly registered with respect to each other.

If the alignment is defective, the operator can correct it by operating the X, Y and 0 control knobs. The displacements will be noted and introduced as corrective inputs in the automatic chip-positioning machine for subsequent improved placement....