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Rectangular Bonding Pad and Spacing Pattern for Large Pad Area and Increased Pad Spacing

IP.com Disclosure Number: IPCOM000049386D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Fritz, RA: AUTHOR

Abstract

Bonding pads to which I/O pins are attached are made rectangular in shape and are arrayed on a circuit module with the long and short directions of the rectangles alternating. This arrangement gives the largest pad to pad spacing possible and still provides a large pad area for brazing the pins to the pads.

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Rectangular Bonding Pad and Spacing Pattern for Large Pad Area and Increased Pad Spacing

Bonding pads to which I/O pins are attached are made rectangular in shape and are arrayed on a circuit module with the long and short directions of the rectangles alternating. This arrangement gives the largest pad to pad spacing possible and still provides a large pad area for brazing the pins to the pads.

Some circuit module designs have circular braze pads to which the I/O pins are attached. This results in defined pad to pad spaces dictated by the geometry of the design. It is necessary to achieve as large a space as possible to preclude reduced pad to pad surface resistivity as a result of electromigration. This design is compatible with present processes to manufacture modules and only redesigned process masks are needed to provide this pad's form factor.

As shown in the drawing, all braze pads are on .100" centers. The minimum space between pads is .035" and the maximum is in excess of .053". This design is applicable to a variety of modules.

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