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Inorganic Resistive Layer for Electrothermal Printing

IP.com Disclosure Number: IPCOM000049432D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chang, LS: AUTHOR

Abstract

A printing ribbon for an electrothermal printing system which utilizes an inorganic resistive layer is described.

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Inorganic Resistive Layer for Electrothermal Printing

A printing ribbon for an electrothermal printing system which utilizes an inorganic resistive layer is described.

The printing ribbon utilizes an inorganic resistive layer such as a cermet material. One specific ribbon comprises a 70/30 SiO/Cr cermet having a thickness of 1500 A on the aluminum side of a 0.2 mil aluminized MYLAR* substrate. The composition is not limited to 70/30 SiO/Cr but, depending on the method of deposition of the layer, may comprise a range of composition, say, from 80/20 SiO/Cr up to 20/80 SiO/Cr, so long as the requirements for thickness and resistivity are achieved.

Other materials may be used as well. For example, codepositing silicon carbide or silicon nitride with some metals, such as nickel or chromium, yields usable resistive layers. Semiconductors or mixtures of semiconductors and metals can also be used.

Ribbons made with these inorganic materials require lower power to print, produce greater thermal stability in the ribbon, and result in fabrication processes more amenable to automation. In addition, due to the much thinner ribbon, a greater printing capacity will result from a * Trademark of E. I. du Pont de Nemours & Co.

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