Browse Prior Art Database

Extended Pin Heat Sink

IP.com Disclosure Number: IPCOM000049508D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Colavito, BC: AUTHOR [+3]

Abstract

The heat-dissipating ability of an electronic module, such as an integrated circuit package, is greatly improved by mounting the module to the printed circuit board with extended pins. The pins are also widened in the direction of air flow to provide a greater surface area for improved dissipation of heat from the pins.

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Extended Pin Heat Sink

The heat-dissipating ability of an electronic module, such as an integrated circuit package, is greatly improved by mounting the module to the printed circuit board with extended pins. The pins are also widened in the direction of air flow to provide a greater surface area for improved dissipation of heat from the pins.

In Fig. 1, integrated circuit module 1 is connected to the lands of the wiring patterns (not shown) on printed circuit board 3 by extended pins 2. The significantly extended length of pins 2 allows improved cooling of module 1 because a better air flow on the underside of the module can take place and because of the heat sinking properties of the extended pins 2 themselves. The thermal radiation characteristics of pins 2 are further enhanced by crimping, flattening, or otherwise widening the pins in the direction of air flow, as shown in Fig. 2. Pin 21 in Fig. 2 has a crimped central portion which requires no additional metal for the pin to provide significantly improved thermal radiation characteristics when compared to pins 2 of constant cross-section.

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