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Increased Wiring Area for Standing Pinned Substrates

IP.com Disclosure Number: IPCOM000049554D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+4]

Abstract

Pins are mechanically fastened by inserting them through a hole in the ceramic substrate and upsetting the pin on the top and bottom of the substrate. The pins are fed into precisely located bushings in a prescribed pin pattern dictated by the holes in the substrates. The pinning equipment is designed so that the substrate locates on the pins. Therefore, if the hole location on the substrate is on the same location as the pins in the bushings, the substrate will fit over the pins. The problem becomes acute when the holes on the substrate vary in reference to the pins located in the bushing block. Forcing the substrates over these pins causes stress in the ceramic which results in its being cracked. The pin head produced on the substrate top surface also reduces the area between the pins.

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Increased Wiring Area for Standing Pinned Substrates

Pins are mechanically fastened by inserting them through a hole in the ceramic substrate and upsetting the pin on the top and bottom of the substrate. The pins are fed into precisely located bushings in a prescribed pin pattern dictated by the holes in the substrates. The pinning equipment is designed so that the substrate locates on the pins. Therefore, if the hole location on the substrate is on the same location as the pins in the bushings, the substrate will fit over the pins. The problem becomes acute when the holes on the substrate vary in reference to the pins located in the bushing block. Forcing the substrates over these pins causes stress in the ceramic which results in its being cracked. The pin head produced on the substrate top surface also reduces the area between the pins. This area is used for wiring channels; therefore, the larger the open area, the more lines that can be filled between the pins.

The above problems can be overcome by tapering the pins and then providing tapered holes in the substrate to enhance fitting the substrate over the pins. The pins are tapered on both ends to eliminate any orientation problems during pin feeding. The holes are tapered so that the opening at the bottom surface of the substrate is larger than the opening at the top surface, and during substrate loading, the bottom of the substrate with the larger openings sees the smaller diameter pin tops. The pins may b...