Browse Prior Art Database

Spacer Technology for High Line Density Panels

IP.com Disclosure Number: IPCOM000049593D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Shapiro, JB: AUTHOR

Abstract

High line density panels require the use of large numbers of small spacer elements. A construction which readily allows the placement of large numbers of such spacers is given in the figure, which is a cross section of a representative segment of a panel.

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Spacer Technology for High Line Density Panels

High line density panels require the use of large numbers of small spacer elements. A construction which readily allows the placement of large numbers of such spacers is given in the figure, which is a cross section of a representative segment of a panel.

Conductor elements 1 are placed on substrate 2 by conventional means. Field assisted bonded (FAB) metal lines 3 are located alternately between the conductors.

Dielectric glass 4 is screened and fired level with the FAB lines 3. Spacer elements (e.g., balls 5 or rods 6) are vibrated into position through a mask. These spacer elements may be precious metal plated. The spacers are then bonded to the FAB wire 3, by applying heat and/or pressure. The FAB lines may be grounded or powered during panel operation to provide cell to cell isolation.

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