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Ethylene Diamine as an Adhesion Promoter between Cured Polymide Layers

IP.com Disclosure Number: IPCOM000049670D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Linde, H: AUTHOR [+2]

Abstract

In the manufacturing of semiconductors and substrates for mounting semiconductors it is often necessary to apply two superimposed layers of polyimide. In the past, problems have been encountered in obtaining good adhesion between the two layers. The present technique provides two superimposed layers of polyimide having excellent adhesion properties one to the other.

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Ethylene Diamine as an Adhesion Promoter between Cured Polymide Layers

In the manufacturing of semiconductors and substrates for mounting semiconductors it is often necessary to apply two superimposed layers of polyimide. In the past, problems have been encountered in obtaining good adhesion between the two layers. The present technique provides two superimposed layers of polyimide having excellent adhesion properties one to the other.

In this technique, a first layer of polyimide is applied to a substrate by applying polyamic acid and curing the applied polyamic acid in a conventional manner to form a polyimide film.

The surface of the cured polyimide is then treated with a lower alkyl diamine, preferably ethylene diamine.

After the diamine treatment, another coating of polyamic acid is applied to the surface and cured in a conventional manner to form a second layer of polyimide. The diamine provides an excellent, strong bond between the first and second layers of polyimide.

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