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Removal of Broken and Undamaged (Signal) Bifurcated Spring Connectors from Printed Circuit Boards

IP.com Disclosure Number: IPCOM000049683D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Dinardo, MD: AUTHOR [+2]

Abstract

A hot push probe machine is provided for removing bifurcated spring connectors and solder from plated through holes in a printed circuit board in a manner which leaves a clear see-through hole suitable for further operations.

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Removal of Broken and Undamaged (Signal) Bifurcated Spring Connectors from Printed Circuit Boards

A hot push probe machine is provided for removing bifurcated spring connectors and solder from plated through holes in a printed circuit board in a manner which leaves a clear see-through hole suitable for further operations.

The machine comprises a thin wire push probe which is mounted in a copper heat sink shield fastened to insulated support rods. A heat source, such as a gas fueled jeweler's torch, extends down between the rods and heats the copper heat sink block which in turn conducts the heat Co the wire push probe. The hot push probe melts the solder in the through hole and pushes out the bifurc ted spring connector. A heated soder sucker removes the solder and the connector to leave a clear see through hole.

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