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Method Of Metallizing Cermet Tiles

IP.com Disclosure Number: IPCOM000049686D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+3]

Abstract

Low thermal conductivity combined with brittleness of the cermet al materials makes it susceptible to cracking due to thermal stresses during sputtering of the cermet target. This warrants an essentially void-free metallic bonding of the cermet tiles to the backing plate of the target assembly. The metallic bonding is achieved by metallizing the bonding surface of the tiles and then solder bonding of the tiles to the backing plate. It becomes necessary to make the proper choice of metals for the metallizing layer, surface preparation of the cermet tiles, and the method of metallization, which are of concern in order to get an adherent metallized layer on the cermet.

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Method Of Metallizing Cermet Tiles

Low thermal conductivity combined with brittleness of the cermet al materials makes it susceptible to cracking due to thermal stresses during sputtering of the cermet target. This warrants an essentially void-free metallic bonding of the cermet tiles to the backing plate of the target assembly. The metallic bonding is achieved by metallizing the bonding surface of the tiles and then solder bonding of the tiles to the backing plate. It becomes necessary to make the proper choice of metals for the metallizing layer, surface preparation of the cermet tiles, and the method of metallization, which are of concern in order to get an adherent metallized layer on the cermet.

The following process steps are found to result in a fail-safe sputtering target which will provide a good hold on the tiles during sputtering operations:
1. Abrasive blasting of the bonding surface of the cermet tiles

with high purity silica sand. This step has been proved to be

essential for achieving good adhesion of the metallized layer

to the cermet.
2. Sputter cleaning of the bonding surface of the cermet tiles

prior to metallization. This step is essential for the

removal of surface contamination from the tiles without

exposing them to any wet chemicals.
3. Sputter deposit approximately 1 K Angstrom of chromium to

promote adhesion of the metallized layer to the

cermet.
4. Sputter deposit approximately 100 K Angstrom of copper

to provide a surface for solder bo...