Browse Prior Art Database

Circuit Module Packaging

IP.com Disclosure Number: IPCOM000049688D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Joshi, KC: AUTHOR [+3]

Abstract

In conventional circuit module packaging, both the circuit chip and the ceramic substrate are relatively rigid. Due to the difference in the thermal expansion coefficients of the chip and the ceramic, it is necessary that the interconnection material between the chip and the substrate be "soft" so that it will deflect and thus accommodate the thermal mismatch strain. Solder connections have been used as "soft" connections.

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Circuit Module Packaging

In conventional circuit module packaging, both the circuit chip and the ceramic substrate are relatively rigid. Due to the difference in the thermal expansion coefficients of the chip and the ceramic, it is necessary that the interconnection material between the chip and the substrate be "soft" so that it will deflect and thus accommodate the thermal mismatch strain. Solder connections have been used as "soft" connections.

The present arrangement, as shown in the drawing, uses a very flexible film 3 and copper elements 5 which are rigid. The flexible film or decal is capable of buckling and thus accommodating thermal strain. The copper elements are deposited on the chip (evaporation or plating) and soldered to the decal. The decal in turn is soldered to module pins 9 of carrier 11.

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