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Browse Prior Art Database

Improvement in Peel A Part Copper

IP.com Disclosure Number: IPCOM000049690D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Canestaro, MJ: AUTHOR [+3]

Abstract

A peel a part copper composite comprises a thin sheet of copper supported by a relatively thick carrier layer. In the fabrication of circuit boards, the composite is laminated to a substrate and the carrier layer is removed. The surface of the thin copper layer is then pumice scrubbed. The resulting copper surface is somewhat nonuniform, thereby creating problems of poor resist adhesion. The surface of the thin layer of copper can be improved by polishing with an organic material, such as SCOTCH BRITE*, or by the use of a metal material, such as a fine copper brush. The object is to achieve a smearing of the copper to smooth the surface.

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Improvement in Peel A Part Copper

A peel a part copper composite comprises a thin sheet of copper supported by a relatively thick carrier layer. In the fabrication of circuit boards, the composite is laminated to a substrate and the carrier layer is removed. The surface of the thin copper layer is then pumice scrubbed. The resulting copper surface is somewhat nonuniform, thereby creating problems of poor resist adhesion. The surface of the thin layer of copper can be improved by polishing with an organic material, such as SCOTCH BRITE*, or by the use of a metal material, such as a fine copper brush. The object is to achieve a smearing of the copper to smooth the surface.

If the thin layer of copper is too thin in some areas, epoxy may come to the surface with mechanical polishing. The thin copper layer may be electrically or electrolytically copper plated to increase the thickness so some additional material is present to achieve the desired smooth uniform surface. * Trademark of 3M Company.

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