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Substrate Flatness Measuring Tool

IP.com Disclosure Number: IPCOM000049692D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Murcko, RM: AUTHOR [+2]

Abstract

The tool shown allows for a rapid and accurate assessment of module bow both prior to soldering of the module onto a card and after soldering. A three point reference system is used for location from the top surface of the module, and a three-point corner referencing system is used for X + Y location of the dial indicator.

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Substrate Flatness Measuring Tool

The tool shown allows for a rapid and accurate assessment of module bow both prior to soldering of the module onto a card and after soldering. A three point reference system is used for location from the top surface of the module, and a three-point corner referencing system is used for X + Y location of the dial indicator.

When using, the operator positions the tool so that pins A encompass the selected corner of the module substrate, and then swings the tool so that pin B just touches the edge of the module. This provides the X and Y location for the dial indicator point. Pins C locate the dial indicator in the Z plane. Since the module usually bows up after soldering, a reading prior to and after soldering allows an assessment of the stresses and forces imparted to the module through the soldering cycle.

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