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Technique to Eliminate Chemical Reaction Between Aluminum Conducting Wires and Dielectric Glass in AC Gas Discharge Display Panel

IP.com Disclosure Number: IPCOM000049738D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Aboelfotoh, MO: AUTHOR [+5]

Abstract

In a geseous discharge display panel, parallel conductor arrays are formed on a pair of glass plates with the conductor arrays disposed substantially orthogonal to each other. These arrays are then covered with a dielectric made of lead-borosilicate glass to eliminate direct contact with the gas, the dielectric layer having a surface of a refractory high secondary-electron emissive material, such as magnesium oxide. By selectively firing single or multiple discharge sites, the resulting firing of orthogonal conductors produces a display.

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Technique to Eliminate Chemical Reaction Between Aluminum Conducting Wires and Dielectric Glass in AC Gas Discharge Display Panel

In a geseous discharge display panel, parallel conductor arrays are formed on a pair of glass plates with the conductor arrays disposed substantially orthogonal to each other. These arrays are then covered with a dielectric made of lead-borosilicate glass to eliminate direct contact with the gas, the dielectric layer having a surface of a refractory high secondary-electron emissive material, such as magnesium oxide. By selectively firing single or multiple discharge sites, the resulting firing of orthogonal conductors produces a display.

One technique to provide the drive conductors on the soda lime silica glass plates is field-assisted bonding of aluminum wires to the glass plates, a fabrication method which may provide a significant cost saving. However, during device processing, the aluminum chemically reacts with the lead-borosilicate glass which is formed over the aluminum wires. This tends to degrade the electrical transport properties of aluminum, resulting in degradation in the electrical characteristics of the device.

In order to avoid degradation of the electrical transport properties of aluminum resulting from chemical reaction with the lead-borosilicate glass during device processing, the aluminum is doped with small amounts of transition elements, such as chromium. During the reflow of the lead borosilicate glass frit, a l...