Browse Prior Art Database

Diffusion Bonding Apparatus

IP.com Disclosure Number: IPCOM000049807D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Chow, WW: AUTHOR [+2]

Abstract

A plurality of ferrite blocks can be diffusion bonded with other ferrite blocks or other compatible ceramic material at one time by placing the samples in a bed of sand within a hot press furnace. An equalized pressure permits diffusion bonding of the blocks at a lower temperature and in a shorter period of time than that accomplished with state of the art techniques.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 72% of the total text.

Page 1 of 2

Diffusion Bonding Apparatus

A plurality of ferrite blocks can be diffusion bonded with other ferrite blocks or other compatible ceramic material at one time by placing the samples in a bed of sand within a hot press furnace. An equalized pressure permits diffusion bonding of the blocks at a lower temperature and in a shorter period of time than that accomplished with state of the art techniques.

As shown in the figure, a plurality of samples 1 are placed within a bed of powder 2 comprising preferably alumina sand of approximately 12-30 mesh. The alumina sand 2 is placed within a mold 3 which can be a cylinder to accommodate the pistons 4 and 5 within the cavity of the mold 3. Spacers (not shown) can be used between the samples 1 to distribute the pressure applied by the pistons 4 and 5. Further samples 1 can be accommodated within a larger mold by placing more samples in a row and/or by placing the samples in a plurality of rows. The mold 3, the spacers and the pistons 4 and 5 can be made of alumina, silicon carbide, silicon nitride or a steel alloy.

In operation, the samples to be diffusion bonded are cemented together by edge tacking to prevent the sand from getting into the bond interface. The samples are then submerged in the sand inside the mold 3. The mold is heated, and a pressure is applied to the pistons 4 and 5. The sand 2 distributes the pressure uniformly against the samples 1, thereby relieving interface shear and controlling the bonding of the sampl...