Browse Prior Art Database

Organosiloxane Alpha Particle Barrier

IP.com Disclosure Number: IPCOM000049860D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Otero, PW: AUTHOR

Abstract

In semiconductor chips with high circuit densities, soft failures have been encountered due to alpha particle emissions. In certain types of modules these alpha particles emanate from the substrate and enter the chip.

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Organosiloxane Alpha Particle Barrier

In semiconductor chips with high circuit densities, soft failures have been encountered due to alpha particle emissions. In certain types of modules these alpha particles emanate from the substrate and enter the chip.

It has been found that very high molecular weight poly dimethyl siloxane materials provide an excellent alpha particle barrier when interposed between the chip and the substrate. Poly dimethyl siloxanes having a molecular weight which will provide a viscosity of about 60,000 cs will be fluid enough to be drawn by capillary action between the chip and substrate and yet be vicious enough not to run, and will maintain themselves between the chip and substrate as an effective alpha particle barrier.

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