Browse Prior Art Database

Tri-Metal Pedestal Forming and Placement Mechanism

IP.com Disclosure Number: IPCOM000049863D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Phelps, DW: AUTHOR [+2]

Abstract

In the manufacture of substrates for accommodating both flip chip type bonding and wire bonding of chips, small pads of a tri-layer solder nickel aluminum metal are required, which are bonded to selected metal pads on the substrate. The tri-metal pads are typically arrayed in a rectangular pattern on the substrate surrounding a site for the locating of a chip which will be wire bonded for the pads. The device in this article cuts the required configuration and number of pads from a strip of material and locates the cut pieces on a substrate.

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Tri-Metal Pedestal Forming and Placement Mechanism

In the manufacture of substrates for accommodating both flip chip type bonding and wire bonding of chips, small pads of a tri-layer solder nickel aluminum metal are required, which are bonded to selected metal pads on the substrate. The tri-metal pads are typically arrayed in a rectangular pattern on the substrate surrounding a site for the locating of a chip which will be wire bonded for the pads. The device in this article cuts the required configuration and number of pads from a strip of material and locates the cut pieces on a substrate.

As a first step, a strip of the device material 10 is provided and is initially punched, as shown on the left side of Fig. 1, to provide a series of "windows" 12, with each window having a plurality of fingers 14 radiating into the window space. The ends of the fingers 14 are sized and arranged into the desired configuration of the array of pads which are to be ultimately applied to the substrate.

A die punch device 16 (Fig. 2) is adapted to index the strip of material 10, bringing the windows 12 successively to a female die 18. The fingers 14 overhang the edge of the die. A male punch member 20 is provided to coact with the female die 18 and shear off the ends of the fingers 14 to form pads 22. Vacuum holes 24 are provided in the punch to retain the pads 22 in the same configuration on the end of the punch as they had as fingers 14 on the strip 10.

The punch member at the en...