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In Situ Sputter Cleaning of Aluminum Copper Silicon Metal During Interrupted Runs

IP.com Disclosure Number: IPCOM000049883D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Giddings, JJ: AUTHOR [+4]

Abstract

Schottky barrier diode transistor logic products have first and second level metal layers of aluminum copper silicon. Problems with E-gun filaments and the resistance heated silicon filament have required that the system be opened prematurely for repairs. The deposited films have incomplete thickness of aluminum-copper or silicon. When the aluminum copper film is removed from the system, a layer of oxide is grown on the surface. If the remaining aluminum-copper and silicon is deposited, the silicon cannot diffuse fully through the oxide layer. This is evidenced by the color of the film after sintering. If the silicon diffuses, the film has the appearance of aluminum. If not, it appears yellow-red.

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In Situ Sputter Cleaning of Aluminum Copper Silicon Metal During Interrupted Runs

Schottky barrier diode transistor logic products have first and second level metal layers of aluminum copper silicon. Problems with E-gun filaments and the resistance heated silicon filament have required that the system be opened prematurely for repairs. The deposited films have incomplete thickness of aluminum-copper or silicon. When the aluminum copper film is removed from the system, a layer of oxide is grown on the surface. If the remaining aluminum- copper and silicon is deposited, the silicon cannot diffuse fully through the oxide layer. This is evidenced by the color of the film after sintering. If the silicon diffuses, the film has the appearance of aluminum. If not, it appears yellow-red. To correct these process deficiencies when it is necessary to open the apparatus prematurely, the oxide is sputter cleaned from the surface and the remaining Al- Cu-Si added in the same system. The yields from jobs recovered with this procedure are equivalent to those obtained from uninterrupted runs and show no evidence of penetration.

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