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Browse Prior Art Database

RIE of Metal Composites to Form Circuitry on Ceramics

IP.com Disclosure Number: IPCOM000049887D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schaible, PM: AUTHOR [+2]

Abstract

A conductive pattern is formed on a ceramic substrate by evaporating a metal blanket layer on the substrate, selectively covering the metal layer with an appropriate mask such as magnesium oxide, and reactive ion etching (RIE) the metal layer.

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RIE of Metal Composites to Form Circuitry on Ceramics

A conductive pattern is formed on a ceramic substrate by evaporating a metal blanket layer on the substrate, selectively covering the metal layer with an appropriate mask such as magnesium oxide, and reactive ion etching (RIE) the metal layer.

The metal blanket layer, which can be a single metal layer or a composite layer consisting of Cu and Cr, is evaporated or sputtered onto a ceramic substrate, such as multilayered ceramic (MLC) and metallized ceramic (MC). A substrate of complexity, such as MLC, can be fabricated utilizing a sintered MLC having only vias in its uppermost layer. After photolithographic processing using step and repeat exposures preceded by via position mapping, a MgO mask is applied.

The substrate is reactive ion etched to form the pattern using a selected gas or gases for achieving etch reactions with the metal system utilized, i.e., in the case of Cu and Cr, Ar and CC1(4) are satisfactory. Time cycles, temperatures and powers are selected based on thickness, gas and reaction considerations. After the metal pattern is formed, the MgO mask is stripped. Appropriate second maskings can be used to further define sockets for face-down chip joining and pads for wire bonding.

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