Browse Prior Art Database

Improved Mobile Memory Convection Cooling

IP.com Disclosure Number: IPCOM000049986D
Publication Date: 2005-Feb-09
Document File: 2 page(s) / 50K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that terminates DDR2 and DDR3 memory on the die. It also uses an air hole on the bottom of a mobile case and a plastic channel to force the air over the memory, and an exhaust fan to remove the air. Benefits include a faster, less expensive mobile system.

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Improved

Mobile

Memory Convection Cooling

Disclosed is a method that terminates DDR2 and DDR3 memory on the die. It also uses an air hole on the bottom of a mobile case and a plastic channel to force the air over the memory, and an exhaust fan to remove the air. Benefits include a faster, less expensive mobile system.

Background

Currently, the bottom of a standard board is a sealed container that has minimal cooling. Current solutions either use two fans to cool the system (i.e. one on the top, and one on the bottom), or retain a closed bottom and use convection or conduction cooling rather than air flow cooling.

General Description

The disclosed method terminates DDR2 and DDR3 memory on the die, instead of on the board. This enables an air hole to be placed on the bottom of a mobile case. A plastic channel helps force air over the memory, and holes in the motherboard send air to the top of the board. An exhaust fan removes the air (see Figures 1 and 2).

Advantages

The disclosed method’s improved air circulation creates cooler memory, enabling it to run at a higher bandwidth and creating better performance. It also uses only one fan for cooling, enabling a less expensive mobile system design.

Fig. 1

Fig. 2

Disclosed anonymously