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Integrated Thermal Interface Material with a Mobile Thermal Solution

IP.com Disclosure Number: IPCOM000050003D
Publication Date: 2005-Feb-09
Document File: 2 page(s) / 13K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses carbon nanotubes (CNT) to reduce the thermal resistance in the thermal interface material (TIM) for a heat pipe or remote heat exchanger in a mobile application.

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Integrated Thermal Interface Material with a

Mobile

Thermal Solution

Disclosed is a method that uses carbon nanotubes (CNT) to reduce the thermal resistance in the thermal interface material (TIM) for a heat pipe or remote heat exchanger in a mobile application.

Background

The TIM is a major contributing factor in the thermal resistance from the junction of a processor to the outside environment. This resistance is exacerbated by its close proximity to the junction of the processor, which results in a high “power density” effect on the TIM resistance.

General Description

The disclosed method uses CNTs to reduce the thermal resistance of the TIM. Recently, CNTs have been found to have very high heat transfer efficiency along the tube. This reduction can be achieved by “growing” the CNTs from the copper surface that makes up the cold plate of the heat pipe/remote heat exchanger solution (see Figure 1). Furthermore, since CNTs make up a large portion of the TIM itself, the resistance through the bulk TIM is also reduced.  Finally, due to the “brush” type contact between the TIM and the die, the contact resistance between the TIM and the die is lower than a conventional TIM. As a result, the integrated TIM concept has a lower resistance that a conventional thermal solution.

Advantages

The disclosed method uses CNTs to reduce the thermal resistance of the TIM.

Fig. 1

Disclosed anonymously