Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Combined Fluid Pump and Low Thermal Resistance Heat Dissipation Device

IP.com Disclosure Number: IPCOM000050011D
Publication Date: 2005-Feb-09
Document File: 2 page(s) / 49K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a rotating disk-based pump (made of housing, a small hub-based motor, and a ribbed disk) to cool larger systems, including desktop computers and servers. Benefits include improving heat transfer and reducing the number of parts within the system.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 68% of the total text.

Combined Fluid Pump and Low Thermal Resistance Heat Dissipation Device

Disclosed is a method that uses a rotating disk-based pump (made of housing, a small hub-based motor, and a ribbed disk) to cool larger systems, including desktop computers and servers. Benefits include improving heat transfer and reducing the number of parts within the system.

Background

The current state of the art uses pumped fluid loops. Each pumped loop contains a separate pump and high efficiency heat transfer device, typically a micro-channel heat exchanger.

General Description

The disclosed method is constructed using a low Z-height housing, a small hub-based motor, and a ribbed disk (see Figures 1 and 2). The ribbing (similar to structures used in turbine blade cooling) is radial on the bottom side of the disk. The internal height of the housing is slightly greater than the ribbed disk height, except for the depression channels that allow fluid to enter and exit, both on one side. These two channels, link up to pipes which form a fluid loop to a remote heat exchanger (for mobile applications) or to a high efficiency active cooling solution (in larger systems such as desktops or servers).

The bottom of the housing is mounted to the processor die, and the motion of the pumped fluid improves heat transfer efficiency due to the scrubbing nature of the pumped fluid. The housing attaches to a flip chip processor or an integrated heat spreader (IHS) based processor as a thermal attach. An extreme versio...