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Browse Prior Art Database

Electrically Conductive Array in an Elastomeric Material

IP.com Disclosure Number: IPCOM000050058D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Neumann, EW: AUTHOR [+2]

Abstract

In the packaging of integrated circuit chips according to one technique, the chips are mounted on ceramic or plastic chip carriers which have through vias that in turn provide connections to pins for plugging into a card, a board, or the like. In one embodiment of this technique the pins are carried by a pin carrier and require connection to the vias of the chip carrier. The device of the present invention provides a good, positive connection between the metallization on the chip carrier and pins supported by the pin carrier and also allows for substantial misalignment and for large tolerance between components.

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Electrically Conductive Array in an Elastomeric Material

In the packaging of integrated circuit chips according to one technique, the chips are mounted on ceramic or plastic chip carriers which have through vias that in turn provide connections to pins for plugging into a card, a board, or the like. In one embodiment of this technique the pins are carried by a pin carrier and require connection to the vias of the chip carrier. The device of the present invention provides a good, positive connection between the metallization on the chip carrier and pins supported by the pin carrier and also allows for substantial misalignment and for large tolerance between components.

Fig. 1 is a perspective view and Fig. 2 is a sectional exploded view of an improved ceramic chip carrier 10, pin carrier 18 and interposer 22. The chip carrier 10 has chips 12 mounted thereon, surface metallization 14 connecting the chips 12, and metal filled vias 16 extending through the chip carrier 10.

The pin carrier 18, which is formed of ceramic or plastic, mounts an array of pins 20, staked onto the carrier and arranged to align with the ends of the vias
16.

An interposer 22 is provided between the pin carrier 18 and chip carrier 10. The interposer is formed of an elastomeric material, such as natural or artificial rubber, and has metal coil or leaf springs 24 embedded therein. The springs 24 are positioned to align with the pins 20 and vias 16.

A suitable clip or cap (not shown) connects the...