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Copper Adhesion Improvement to Polyimide by Interface Oxidation

IP.com Disclosure Number: IPCOM000050060D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fontaine, BK: AUTHOR

Abstract

It has been found that the adhesion of copper to polyimide during vacuum vapor deposition of copper onto polyimide can be improved by adding a small amount of oxygen to the process during the initial stages of deposition of the copper. In practice, it has been found that if oxygen is bled into the system at a constant pressure of 10/-5/ torr during the deposition of about the first 800 Angstroms of copper during the deposition of copper into a polyimide surface, the adhesion of the copper to the polyimide is significantly enhanced.

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Copper Adhesion Improvement to Polyimide by Interface Oxidation

It has been found that the adhesion of copper to polyimide during vacuum vapor deposition of copper onto polyimide can be improved by adding a small amount of oxygen to the process during the initial stages of deposition of the copper. In practice, it has been found that if oxygen is bled into the system at a constant pressure of 10/-5/ torr during the deposition of about the first 800 Angstroms of copper during the deposition of copper into a polyimide surface, the adhesion of the copper to the polyimide is significantly enhanced.

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