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Browse Prior Art Database

Adhesive Metal Shim Module Capping Technique

IP.com Disclosure Number: IPCOM000050081D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Dunn, RM: AUTHOR [+3]

Abstract

This arrangement provides a means of capping (temporarily or otherwise) single or multi-chip modules in such a way as to render the caps easily removable and the remaining adhesive residue readily cleanable.

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Adhesive Metal Shim Module Capping Technique

This arrangement provides a means of capping (temporarily or otherwise) single or multi-chip modules in such a way as to render the caps easily removable and the remaining adhesive residue readily cleanable.

Certain module packages require that the spacing between the heatsink cap and the ceramic substrate be kept at a specified small distance for purposes of accurate thermal grease thickness between the underside of the heatsink cap and the tops of the chips. In addition, system users of such modules require that the heatsink cap be readily removable for purposes of engineering changes on the substrate during the initial development of a new computer. This removability must be capable of being performed many times on a single module, a condition that the permanent method of capping (solder seal) cannot tolerate.

The proposed method uses a thin metal shim 3 stamped out in a square doughnut pattern, with similarly shaped thermoplastic dry film adhesive pieces 5 on each side of the metal. (The adhesive pieces are pre adhered to the shim by heat activation). When placed in a clamping fixture, the adhesive metal shim goes between the heatsink cap 7 and the substrate 9, and the entire assembly is clamped together with the required force. Heat activation at 100 degrees C causes the adhesive to melt and join the entire assembly. The activation temperature for this thermoplastic adhesive is low enough so as not to cause any co...