Browse Prior Art Database

Pretreatment of Peel a Part Copper

IP.com Disclosure Number: IPCOM000050083D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Wiley, RT: AUTHOR

Abstract

Commercially available peel a part copper can be used to fabricate printed circuit boards. Improved quality can be achieved by pretreating the peel a part copper in a sodium persulfate bath. This bath is applied after the peel a part copper layer is laminated to the substrate and the carrier has been removed. The treatment consists of 30-90 seconds in a room temperature bath which has 2 pounds per gallon of sodium persulfate and 2 percent sulfuric acid.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Pretreatment of Peel a Part Copper

Commercially available peel a part copper can be used to fabricate printed circuit boards. Improved quality can be achieved by pretreating the peel a part copper in a sodium persulfate bath. This bath is applied after the peel a part copper layer is laminated to the substrate and the carrier has been removed. The treatment consists of 30-90 seconds in a room temperature bath which has 2 pounds per gallon of sodium persulfate and 2 percent sulfuric acid.

This pretreatment eliminates line nicks, ragged lines, black stain, pink spots and the under resist penetration of any subsequent additive plating bath.

1