Browse Prior Art Database

Individual Blind Via Testing

IP.com Disclosure Number: IPCOM000050085D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

DeRoos, A: AUTHOR [+2]

Abstract

The individual bond or contact force of additive plated blind vias may be determined by the process described below.

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This is the abbreviated version, containing approximately 100% of the total text.

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Individual Blind Via Testing

The individual bond or contact force of additive plated blind vias may be determined by the process described below.

An individual blind via in a test site on a printed circuit board is selected, and the board is cut with a scalpel to circumscribe the test portion. The scalpel is also used to cut the glass fibers between the individual blind vias in a cross-hatch pattern. Using a soldering iron tip of appropriate diameter heated to 315 degrees C, the tip is soldered to the top copper of the blind via. When the solder is solidified (280 degrees C) but while the epoxy is still molten, the test via is pulled from the board by withdrawing the solder tip. The solder tip with the attached via is then placed in a tensile tester, with the other end of the via gripped by a suitable clamp. The tensile force is then increased until the via elements separate and the tensile response is measured and recorded.

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