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High Speed Transfer of Conductors for Field Assisted Bonding to Glass Plates

IP.com Disclosure Number: IPCOM000050204D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Horstmann, RE: AUTHOR

Abstract

Field-assisted bonding (FAB) of wires (a1) on the order of .02 mm diameter to glass plates, such as plate 10 in Fig. 1, which requires transfer of the wire from a drum, such as drum 11 in Fig. 1. or from a plate onto a glass panel, such as plate 10, has been unsatisfactory in the past due to the wandering of the wires during the process of transfer.

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High Speed Transfer of Conductors for Field Assisted Bonding to Glass Plates

Field-assisted bonding (FAB) of wires (a1) on the order of
.02 mm diameter to glass plates, such as plate 10 in Fig. 1, which requires transfer of the wire from a drum, such as drum 11 in Fig. 1. or from a plate onto a glass panel, such as plate 10, has been unsatisfactory in the past due to the wandering of the wires during the process of transfer.

The proposed method provides a means of holding the wires in place during this process of transfer. An attractive force is used. Because the FAB process employs a substantial voltage on the order of about 1,000 volts DC, an electrostatic voltage of V(2) is applied across the plate 10 and the wire W. Voltage source V(1) is connected at one end to carrier 9 which supports the glass plate 10. At its positive end source V(2) is connected to wire W at point C. Voltage V(1) is applied from point C to metallic coating 12 on the inside of drum 11 by commutator 14. The temperature of drum 11 is 150 degrees C while that of the carrier 9 is about 200 degrees C. The 500 volts across the drum 11 and wire W is sufficient at 150 degrees C to hold wire W to the solid electrolyte drum
11. Typically, drum 11 is soda lime glass or PYREX*. The 500 volts holds wire W firmly, but is insufficient to bond wire W, to drum 11.

Transfer and bonding are accomplished by having the glass plate 10 maintained at the higher voltage (bonding voltage) of 1000 volts relative to...