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Method of Aligning Optical Fibers with LSI Chips Containing Optical Light Emitting Sources AND/OR Receivers

IP.com Disclosure Number: IPCOM000050245D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Balliet, L: AUTHOR [+3]

Abstract

As shown in the drawing, a chip containing a light emitting (or receiving) diode (LED) can be easily aligned with an optical fiber waveguide.

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Method of Aligning Optical Fibers with LSI Chips Containing Optical Light Emitting Sources AND/OR Receivers

As shown in the drawing, a chip containing a light emitting (or receiving) diode (LED) can be easily aligned with an optical fiber waveguide.

Retaining block 1 contains alignment grooves 2 and 3 (Fig. 1) for respectively retaining the LED chip and fiber in axial alignment (Fig. 2). It is desirable to orient the groove 2 at an angle to the mounting plane 4. Assembly is simplified and consists of applying conductive adhesive and placing chip 5, containing LED 6, and fiber 7 in respective grooves with edges and surfaces butted. There is no requirement to provide assembly clearance.

In the specific example shown, the groove 2 is formed at an angle of 45 degrees to mounting plane 4. The grooves are formed to very precise dimensions by coining with a precision punch made of hardened steel or tungsten carbide. Critical tolerances are eliminated and adequate alignment is achieved and limited only by the precision of chip fabrication tolerance.

Extensions of the foregoing to the mounting of chips containing light receiving elements and/or chips containing plural light emitting (or receiving) elements and plural optical fiber waveguides should be readily apparent to those skilled in the art.

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