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Print Wire Molded Guide

IP.com Disclosure Number: IPCOM000050249D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Rieland, RA: AUTHOR

Abstract

Tungsten carbide wires which are used in wire matrix printheads are prone to wire fracture. The demands for faster throughput with improved print quality may aggravate this condition with the implementation of curved, longer wire paths and smaller diameter wires. Conventional printheads support the wires with spaced inserts or completely molded wire paths. These designs have unsupported sections due to friction considerations, wire alignment and printhead assembly.

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Print Wire Molded Guide

Tungsten carbide wires which are used in wire matrix printheads are prone to wire fracture. The demands for faster throughput with improved print quality may aggravate this condition with the implementation of curved, longer wire paths and smaller diameter wires. Conventional printheads support the wires with spaced inserts or completely molded wire paths. These designs have unsupported sections due to friction considerations, wire alignment and printhead assembly.

The print wires could be encapsulated in a nylon glass reinforced or other polymer material suitable for molding a thin sleeve over the print wire. This molded sleeve may extend over the entire length of the print wire, as shown in Fig. 1, or just in the unsupported sections, as shown in Fig. 2, where wire fracture is most likely to occur. Encapsulation would decrease the wire deflection and also absorb wire impact shock waves, thereby increasing the print force required to fracture the wire.

Additional wire path clearance could be utilized due to the increased support. This improved wire guiding with minimal frictional increase will deliver more usable energy for printing, thereby increasing the efficiency.

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