Browse Prior Art Database

Adhesion Enhancement of Circuitry to Polyimide

IP.com Disclosure Number: IPCOM000050280D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Franchak, NP: AUTHOR [+3]

Abstract

In the processing of MCP (metallized ceramic polyimide) substrates, after final circuitization and prior to the pinning operation, the substrates are subjected to rolling pressure and heat which results in the enhancement of copper-polyimide adhesion and stress relief. In the process, the substrates are passed between a flexible and heated rubber-coated roller under pressure, causing some imbedding of the circuit lines into the polyimide. The roller is provided with an outer sleeve of TEFLON*. The roller is spring-loaded to give line contact pressure. The rubber on the roller slightly imbeds the circuit lines into the polyimide without crushing the vias. * Trademark of E.I. du Pont de Nemours and Co.

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Adhesion Enhancement of Circuitry to Polyimide

In the processing of MCP (metallized ceramic polyimide) substrates, after final circuitization and prior to the pinning operation, the substrates are subjected to rolling pressure and heat which results in the enhancement of copper- polyimide adhesion and stress relief. In the process, the substrates are passed between a flexible and heated rubber-coated roller under pressure, causing some imbedding of the circuit lines into the polyimide. The roller is provided with an outer sleeve of TEFLON*. The roller is spring-loaded to give line contact pressure. The rubber on the roller slightly imbeds the circuit lines into the polyimide without crushing the vias. * Trademark of E.I. du Pont de Nemours and Co.

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